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Savio TG-05 1g, Termisk pasta, 18 W/m·K, 2,6 g/cm³, Grå, 40 - 230 °C, CE WEE
Varenr.: [25432884] | Producent: SAVIO | Model-nr.: TG-05 1g | EAN: 5902768707779
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GLACIER 1g Thermal Paste, TG-05
In the world of gaming, where every frame counts, your CPU's temperature is key to stability. SAVIO GLACIER TG-05 Thermal Paste is an advanced solution for gamers who don't compromise on cooling performance.
Effective Thermal Conductivity
Your components deserve rapid heat transfer to the heatsink. Thanks to its high thermal conductivity (the ability of a material to transfer heat) of 18.0 W/m-K, TG-05 guarantees rapid heat dissipation from the CPU. This means lower operating temperatures, longer hardware lifespan, and stable gameplay even during the most demanding sessions.
Three Weights
Whether you're building a single dream build or regularly servicing your PCs, we have the right amount of material for you. The paste is available in three weights, allowing you to perfectly match your purchase to your current needs.
Safe Application
With GLACIER TG-05, you don't have to worry about damaging electronics. The paste has an electrical conductivity (the ability of a material to conduct electricity) of 0 ps/m. This means the product is a safe insulator, and even accidental application to small components of the motherboard won't cause a short circuit.
Ease of Application
Even if this is your first time replacing your thermal paste, TG-05 will make it a professional solution. The optimal density of 2.6 +/- 0.1 g/ml ensures a perfect consistency. The paste doesn't run and spreads easily across the surface, filling microscopic imperfections, as evidenced by its low thermal impedance (the resistance a material offers to heat flow) of just 1.16 cm² K/W.
Perfect for Overclockers
If you push your rig to the limit by overclocking (pushing components beyond their factory specifications to increase performance), the TG-05 is perfect for you. With an extremely wide operating temperature range (the range within which the paste retains its properties) of -40–230 degrees C, this product will perform well even in the most extreme cooling scenarios.
In the world of gaming, where every frame counts, your CPU's temperature is key to stability. SAVIO GLACIER TG-05 Thermal Paste is an advanced solution for gamers who don't compromise on cooling performance.
Effective Thermal Conductivity
Your components deserve rapid heat transfer to the heatsink. Thanks to its high thermal conductivity (the ability of a material to transfer heat) of 18.0 W/m-K, TG-05 guarantees rapid heat dissipation from the CPU. This means lower operating temperatures, longer hardware lifespan, and stable gameplay even during the most demanding sessions.
Three Weights
Whether you're building a single dream build or regularly servicing your PCs, we have the right amount of material for you. The paste is available in three weights, allowing you to perfectly match your purchase to your current needs.
Safe Application
With GLACIER TG-05, you don't have to worry about damaging electronics. The paste has an electrical conductivity (the ability of a material to conduct electricity) of 0 ps/m. This means the product is a safe insulator, and even accidental application to small components of the motherboard won't cause a short circuit.
Ease of Application
Even if this is your first time replacing your thermal paste, TG-05 will make it a professional solution. The optimal density of 2.6 +/- 0.1 g/ml ensures a perfect consistency. The paste doesn't run and spreads easily across the surface, filling microscopic imperfections, as evidenced by its low thermal impedance (the resistance a material offers to heat flow) of just 1.16 cm² K/W.
Perfect for Overclockers
If you push your rig to the limit by overclocking (pushing components beyond their factory specifications to increase performance), the TG-05 is perfect for you. With an extremely wide operating temperature range (the range within which the paste retains its properties) of -40–230 degrees C, this product will perform well even in the most extreme cooling scenarios.